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Cadence partners with TSMC, Microsoft to boost digital timing signoff

Cadence partners with TSMC, Microsoft to boost digital timing signoff
Cadence partners with TSMC, Microsoft to boost digital timing signoff

American computer software company, Cadence Design Systems, Inc. has announced the results of its 2021 three-way collaboration with the Taiwanese semiconductor manufacturer (TSMC) and tech giant Microsoft Corporation.

The collaboration will be focusing on utilizing cloud infrastructure that can be used to accelerate the digital timing signoff of more than 10 billion transistor designs, that can be used in advanced applications such as graphics, hyper-scale computing, and machine learning (ML) applications.

As these designs are usually large, engineers are often challenged in meeting the schedule and calculating the budget. However, with this collaboration, common customers will be able to not only accelerate the signoff schedule of their design but also reduce the overall cost.

Suk Lee, VP, Design Infrastructure Management Division, TSMC, stated that after a year of collaborating with Cadence and Microsoft through its OIP Cloud Alliance, their mutual customers have been able to access TSMC’s advanced technologies, as well as Cadence’s signoff solutions and portfolio along with Microsoft Azure’s platform, which could easily handle giga-scale designs and allow them to quickly launch their products in the market.

Mujtaba Hamid, GM, Silicon, Modeling and Simulation, Microsoft Azure, stated that by collaborating with Cadence and TSMC, they are paving the path of accelerated silicon design through cloud, which is allowing the industry to deliver products with the highest of quality, while also achieving time-to-market goals.

The Cadence Tempus Timing Signoff Solution, which allows customers to predict as well as accelerate the path to design closure, is available under a full flow digital suite. With Cadence CloudBurst Platform, which is under the Cadence Cloud Portfolio, customers can easily and quickly access pre-installed tools.

Talking about the collaboration, Dr. Chin-Chi Teng, Senior VP and GM, Digital and Signoff Group, Cadence, has stated that with TSMC and Microsoft, the company can set new industry benchmarks while also enhancing customers’ ability in meeting schedules by using the Tempus Timing Signoff Solution for cloud.

Source Credit: https://www.businesswire.com/news/home/20211201005400/en/Cadence-Expands-Collaboration-with-TSMC-and-Microsoft-to-Accelerate-Timing-Signoff-for-Giga-Scale-Designs-on-the-Cloud

 

 

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Vinisha Joshi

Vinisha Joshi

Despite graduating with an engineering degree in electronics and communication, Vinisha Joshi chose the road less travelled, and decided to pursue her career in content writing . Currently, she pens down articles for cuereport.com and a few other distinguished news platforms, pertaining to business and finance.